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| 相變化材／Phase-Chang Material PCM |  |  |
熱阻最低之散熱材、不易老化、不揮發、易重工，到達設定溫度時固態相變為半液態，以增加接觸面積
【Characteristic】
Thermal resistance of the lowest heat material, not aging, non-volatile, easy to rework, to reach the set temperature when the solid phase into a semi-liquid to increase the contact area
【應用】
主要以減少低散熱能力或高熱源的電子元件和散熱片之間的熱阻。低熱阻的傳導，可提高散熱器的性能，提高元件的可靠性
【【Application】
Reduce the low heat dissipation capacity or high heat resistance between the electronic components and heat sinks. Low thermal resistance of the conduction, can improve the performance of the radiator to improve the reliability of components
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| 熱輻射材／Heat Radiation Material | | |
絕佳散熱性、具高電性絕緣、附著性佳、耐高溫
【Characteristic】
Excellent heat dissipation, High performance of isolation, water resist, High transmittance
【應用】
可噴塗於多種材料、也可做塑膠射出成型、也能當絕緣材使用
【【Application】
Can be sprayed on a variety of materials, plastic injection molding and insulating materials
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| 導熱膠帶／Thermal Conductive Adhesive | | |
良好的黏著性、低接觸熱阻、良好的導熱性、可高溫操作性、高電氣絕緣 、柔軟及可壓縮性、易施工
【Characteristic】
Good adhesion, low contact resistance, good thermal conductivity, high temperature operation, high electrical insulation, soft and compressible, easy construction
【應用】
主要用於填補兩種材料接合或接觸時產生的空隙及表面的孔洞，減少熱傳遞的的阻抗，提高散熱性
【【Application】
Used to fill the two materials when the contact or contact with the voids and surface holes, reduce the heat transfer impedance, improve heat dissipation